Parameter | Kakayahan |
Uri ng Assembly | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum na Sukat ng Bahagi | 0201 |
Pinakamataas na Sukat ng Bahagi | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Mga Uri ng Component Package | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, atbp. |
Pinakamababang Pad Pitch | 0.5 mm (20 mil) para sa QFP, QFN, 0.8 mm (32 mil) para sa BGA |
Materyal ng Board | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, atbp. |
Ibabaw ng Tapos | OSP, HASL, Flash Gold, ENIG, Gold Finger, atbp. |
Uri ng Solder Paste | Leaded o Lead-Free |
Proseso ng Pagpupulong | Reflow Soldering, Wave Soldering, Manual Soldering |
Mga Paraan ng Inspeksyon | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Mga Paraan ng Pagsubok sa loob ng Bahay | Functional Test, Probe Test, Aging Test, High and Low Temperature & Humidity Test |
Oras ng Turnaround | Sampling: 24 na oras hanggang 7 araw, Mass Run: 10 - 30 araw |
Mga Pamantayan ng PCB Assembly | ISO9001:2015; ROHS, UL 94V0, IPC-610E klase ll |
Delivery Service
Payment Options